Sheet No.: DG-072011
10
GM5ZR96270A
?SPAN class="pst GM5ZR96270A_2655836_2">Manufacturing Guidelines
?SPAN class="pst GM5ZR96270A_2655836_2">Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
See Fig. 12.
2. Store these parts between 5癈 and 30癈, at a relative humidity of less than 60%.
3. After breaking the package seal, maintain the environment within 5癈 to 30癈, at a relative humidity of less than
60%. Solder the parts within 3 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
5. If the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination,
bake the parts:
"When in the tape carrier, bake them at a temperature of 95癈 to 100癈, for 16 to 24 hours.
"When loose (in a metal tray) or on a PCB, bake them at a temperature of 110癈 to 120癈, for 8 to 12 hours.
"Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled
to room temperature after baking.
?SPAN class="pst GM5ZR96270A_2655836_2">Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device. Process chemicals will affect
the structural and optical characteristics of this device.
2. Sharp recommends the use of solder paste that does not require cleaning.
3. Avoid cleaning this part ultrasonically. If ultrasonic cleaning is unavoidable, verify the process before use, as the
size of the bath, its duration, ultrasonic intensity, and PCB size and shape can affect the process. Recom-
mended solvents are water or isopropyl alcohol.
Fig. 12 Factory Moisture-proof Packaging
Aluminum
package
Silica gel
Reel
L l
Label
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